Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12009337 | Bonding tool and bonding method thereof | Shih-Yen Chen, Chi-Chun Peng, HONG-KUN CHEN, Hui-Ting Lin | 2024-06-11 |
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Chih-Yuan Chiu
Overall (2024): #514,976 of 561,600Top 95%
1
Patents 2024