HL

Hui-Ting Lin

TSMC: 1 patents #2,264 of 4,162Top 55%
📍 Tainan, TW: #299 of 783 inventorsTop 40%
Overall (2024): #439,324 of 561,600Top 80%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12009337 Bonding tool and bonding method thereof Chih-Yuan Chiu, Shih-Yen Chen, Chi-Chun Peng, HONG-KUN CHEN 2024-06-11