Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11973010 | Chip packaging method and chip package unit | Heng-Chi Huang, Yong-Zhong Hu | 2024-04-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11973010 | Chip packaging method and chip package unit | Heng-Chi Huang, Yong-Zhong Hu | 2024-04-30 |