Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062570 | High voltage device and manufacturing method thereof | Kun-Huang Yu, Chien-Yu Chen, Ting-Wei Liao, Chih-Wen Hsiung, Chun-Lung Chang +4 more | 2024-08-13 |
| 11973010 | Chip packaging method and chip package unit | Hao-Lin Yen, Heng-Chi Huang | 2024-04-30 |