Issued Patents 2024
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125721 | Parallelism-adjustable bonding machine | Jing-Cheng Lin, Mao-Chan Chang | 2024-10-22 |
| 12040215 | Bonding machine with movable suction modules | Jing-Cheng Lin | 2024-07-16 |
| 12031208 | Atomic layer deposition apparatus for powders | Jing-Cheng Lin, Chia-Cheng Ku | 2024-07-09 |
| 12033968 | Package structure including stacked pillar portions | Szu-Wei Lu, Ying-Ching Shih | 2024-07-09 |
| 12006571 | Atomic layer deposition apparatus for coating on fine powders | Jing-Cheng Lin, CHING-LIANG YI, Chia-Cheng Ku | 2024-06-11 |
| 11987883 | Powder atomic layer deposition apparatus for blowing powders | Jing-Cheng Lin, Chia-Cheng Ku | 2024-05-21 |
| 11961753 | Substrate-bonding device | Jing-Cheng Lin, Mao-Chan Chang | 2024-04-16 |
| 11952662 | Powder atomic layer deposition equipment with quick release function | Jing-Cheng Lin, Chia-Cheng Ku | 2024-04-09 |
| 11948876 | Package structure with through vias | Ling Li, Cheng-Lin Huang | 2024-04-02 |