Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125721 | Parallelism-adjustable bonding machine | Jing-Cheng Lin, Jung-Hua Chang | 2024-10-22 |
| 11961753 | Substrate-bonding device | Jing-Cheng Lin, Jung-Hua Chang | 2024-04-16 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125721 | Parallelism-adjustable bonding machine | Jing-Cheng Lin, Jung-Hua Chang | 2024-10-22 |
| 11961753 | Substrate-bonding device | Jing-Cheng Lin, Jung-Hua Chang | 2024-04-16 |