Issued Patents 2024
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170242 | Fan-out wafer level package structure | — | 2024-12-17 |
| 12148661 | Method of forming integrated fan-out packages with built-in heat sink | Chih-Wei Wu, Ying-Ching Shih, Szu-Wei Lu, Long Hua Lee | 2024-11-19 |
| 12131898 | Bonded semiconductor structures | — | 2024-10-29 |
| 12129541 | Deposition method for tuning magnetic field distribution of deposition equipment | — | 2024-10-29 |
| 12123092 | Powder-atomic-layer-deposition device with knocker | Chia-Cheng Ku | 2024-10-22 |
| 12125721 | Parallelism-adjustable bonding machine | Jung-Hua Chang, Mao-Chan Chang | 2024-10-22 |
| 12080617 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Li-Chung Kuo, Ying-Ching Shih, Szu-Wei Lu, Long Hua Lee +1 more | 2024-09-03 |
| 12068224 | Semiconductor packages having thermal conductive pattern | Szu-Wei Lu | 2024-08-20 |
| 12057432 | Integrated fan-out package structures with recesses in molding compound | Po-Hao Tsai, Li-Hui Cheng, Jui-Pin Hung | 2024-08-06 |
| 12040215 | Bonding machine with movable suction modules | Jung-Hua Chang | 2024-07-16 |
| 12031208 | Atomic layer deposition apparatus for powders | Jung-Hua Chang, Chia-Cheng Ku | 2024-07-09 |
| 12006571 | Atomic layer deposition apparatus for coating on fine powders | CHING-LIANG YI, Jung-Hua Chang, Chia-Cheng Ku | 2024-06-11 |
| 11987883 | Powder atomic layer deposition apparatus for blowing powders | Jung-Hua Chang, Chia-Cheng Ku | 2024-05-21 |
| 11981990 | Deposition equipment with shielding mechanism | Yu-Te Shen | 2024-05-14 |
| 11972936 | Shielding device and thin-film-deposition equipment with the same | — | 2024-04-30 |
| 11961753 | Substrate-bonding device | Jung-Hua Chang, Mao-Chan Chang | 2024-04-16 |
| 11961724 | Shielding device and thin-film-deposition equipment with the same | Yu-Te Shen | 2024-04-16 |
| 11952662 | Powder atomic layer deposition equipment with quick release function | Jung-Hua Chang, Chia-Cheng Ku | 2024-04-09 |
| 11955459 | Package structure | Shu-Hang Liao, Chih-Wei Wu, Szu-Wei Lu, Ying-Ching Shih | 2024-04-09 |
| 11935866 | Semiconductor device having reduced bump height variation | Po-Hao Tsai | 2024-03-19 |
| 11929242 | Shielding mechanism and thin-film-deposition equipment using the same | — | 2024-03-12 |
| 11901302 | InFO-POP structures with TIVs having cavities | Chen-Hua Yu, Po-Hao Tsai | 2024-02-13 |
| 11898238 | Shielding device and thin-film-deposition equipment with the same | Yu-Te Shen | 2024-02-13 |
| 11891694 | Atomic-layer-deposition equipment and atomiclayer-deposition method by using the same | — | 2024-02-06 |
| 11891695 | Vibrating deposition device | — | 2024-02-06 |