Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148661 | Method of forming integrated fan-out packages with built-in heat sink | Chih-Wei Wu, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin | 2024-11-19 |
| 12080617 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Li-Chung Kuo, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin +1 more | 2024-09-03 |