Issued Patents 2024
Showing 1–25 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176261 | Method of fabricating package structure | Chih-Hao Chen, Chin-Fu Kao, Li-Hui Cheng | 2024-12-24 |
| 12170236 | Method for forming package structure | Chih-Hao Chen, Chih-Chien Pan, Li-Hui Cheng, Chin-Fu Kao | 2024-12-17 |
| 12165978 | Package structure and method of manufacturing the same | Shih-Ting Lin | 2024-12-10 |
| 12148661 | Method of forming integrated fan-out packages with built-in heat sink | Chih-Wei Wu, Ying-Ching Shih, Jing-Cheng Lin, Long Hua Lee | 2024-11-19 |
| 12142499 | Pickup apparatus and method of using the same | Yi-Jung Chen, Tsung-Fu Tsai | 2024-11-12 |
| 12142579 | Package structure and manufacturing method thereof | Tsung-Fu Tsai, Shih-Ting Lin, Chen-Hsuan Tsai, I-Ting Huang | 2024-11-12 |
| 12132004 | Semiconductor devices and methods of manufacture | Chih-Hao Chen, Pu Wang, Li-Hui Cheng | 2024-10-29 |
| 12131965 | Apparatus for detecting end point | Yi-Chao Mao, Chin-Chuan Chang | 2024-10-29 |
| 12119324 | Package structure | Kung-Chen Yeh, Tsung-Fu Tsai, Ying-Ching Shih | 2024-10-15 |
| 12100640 | High efficiency heat dissipation using thermal interface material film | Chih-Hao Chen, Hung-Yu Chen, Pu Wang, Li-Hui Cheng | 2024-09-24 |
| 12080617 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Li-Chung Kuo, Ying-Ching Shih, Jing-Cheng Lin, Long Hua Lee +1 more | 2024-09-03 |
| 12074119 | Chip package structure | Jiun-Ting Chen, Ying-Ching Shih, Chih-Wei Wu | 2024-08-27 |
| 12074112 | Package structure | Chin-Chuan Chang | 2024-08-27 |
| 12068218 | Package structures | Pu Wang, Chin-Fu Kao | 2024-08-20 |
| 12068224 | Semiconductor packages having thermal conductive pattern | Jing-Cheng Lin | 2024-08-20 |
| 12068173 | Package structure and manufacturing method thereof | Li-Hui Cheng, Ping-Yin Hsieh, Chih-Hao Chen | 2024-08-20 |
| 12051652 | Package structure and method of fabricating the same | Shih-Ting Lin, Chi-Hsi Wu, Chen-Hua Yu | 2024-07-30 |
| 12046561 | Package structure and method of fabricating the same | Tsung-Fu Tsai | 2024-07-23 |
| 12033968 | Package structure including stacked pillar portions | Jung-Hua Chang, Ying-Ching Shih | 2024-07-09 |
| 12033912 | Package structure and manufacturing method thereof | Ping-Yin Hsieh, Li-Hui Cheng, Pu Wang | 2024-07-09 |
| 12033949 | Package structure with bridge die laterally wrapped by insulating encapsulant and surrounded by through vias and method of forming the package structure | Yu-Hung Lin, Chih-Wei Wu, Chia-Nan Yuan, Ying-Ching Shih, An-Jhih Su +2 more | 2024-07-09 |
| 12033978 | Semiconductor package and manufacturing method thereof | Ying-Ching Shih, Chih-Wei Wu | 2024-07-09 |
| 12020952 | Method of fabricating semiconductor device having dummy micro bumps between stacking dies | Tsung-Fu Tsai, Chen-Hsuan Tsai, Chung Chieh TING, Shih-Ting Lin | 2024-06-25 |
| 12021008 | Thermal interface materials, 3D semiconductor packages and methods of manufacture | Chen-Hua Yu, Li-Chung Kuo, Ying-Ching Shih | 2024-06-25 |
| 11996375 | Integrated circuit structure, and method for forming thereof | Yi-Chao Mao, Chin-Chuan Chang, Kun-Tong Tsai, Hung Chih Chen | 2024-05-28 |