Issued Patents 2024
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176261 | Method of fabricating package structure | Chih-Hao Chen, Li-Hui Cheng, Szu-Wei Lu | 2024-12-24 |
| 12170236 | Method for forming package structure | Chih-Hao Chen, Chih-Chien Pan, Li-Hui Cheng, Szu-Wei Lu | 2024-12-17 |
| 12131974 | Semiconductor package and method of manufacturing semiconductor package | Chen-Shien Chen | 2024-10-29 |
| 12119237 | Semiconductor device package having metal thermal interface material | Chien-Li Kuo, Chen-Shien Chen | 2024-10-15 |
| 12068218 | Package structures | Pu Wang, Szu-Wei Lu | 2024-08-20 |
| 12015023 | Integrated circuit package and method of forming same | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more | 2024-06-18 |
| 11978720 | Semiconductor device package and methods of manufacture | Kai Jun Zhan, Kuang-Chun Lee, Ming-Da Cheng, Chen-Shien Chen | 2024-05-07 |
| 11942403 | Integrated circuit package and method | Chih-Chien Pan, Li-Hui Cheng, Szu-Wei Lu | 2024-03-26 |
| 11901255 | Semiconductor device and method of forming the same | Chih-Chien Pan, Li-Hui Cheng, Szu-Wei Lu | 2024-02-13 |
| 11894287 | Adhesive and thermal interface material on a plurality of dies covered by a lid | Chih-Hao Chen, Li-Hui Cheng, Szu-Wei Lu, Chih-Chien Pan | 2024-02-06 |