Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170236 | Method for forming package structure | Chih-Hao Chen, Li-Hui Cheng, Chin-Fu Kao, Szu-Wei Lu | 2024-12-17 |
| 11942403 | Integrated circuit package and method | Li-Hui Cheng, Chin-Fu Kao, Szu-Wei Lu | 2024-03-26 |
| 11901255 | Semiconductor device and method of forming the same | Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu | 2024-02-13 |
| 11894287 | Adhesive and thermal interface material on a plurality of dies covered by a lid | Chih-Hao Chen, Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu | 2024-02-06 |