Issued Patents 2024
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176261 | Method of fabricating package structure | Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu | 2024-12-24 |
| 12170236 | Method for forming package structure | Chih-Chien Pan, Li-Hui Cheng, Chin-Fu Kao, Szu-Wei Lu | 2024-12-17 |
| 12155019 | Light-emitting device | Hsin-Ying Wang, Chien-Chih Liao, Chao-Hsing Chen, Wu-Tsung Lo, Tsun-Kai Ko +1 more | 2024-11-26 |
| 12132004 | Semiconductor devices and methods of manufacture | Pu Wang, Li-Hui Cheng, Szu-Wei Lu | 2024-10-29 |
| 12100640 | High efficiency heat dissipation using thermal interface material film | Hung-Yu Chen, Pu Wang, Li-Hui Cheng, Szu-Wei Lu | 2024-09-24 |
| 12068173 | Package structure and manufacturing method thereof | Li-Hui Cheng, Szu-Wei Lu, Ping-Yin Hsieh | 2024-08-20 |
| D1036530 | Surveillance camera | Wei-Kai Tang | 2024-07-23 |
| RE50000 | Keyswitch structure | Chih-Hung Chen, Chin-Hung Lin, Ling-Hsi Chao, Chih-Chung Yen | 2024-06-04 |
| 12002711 | Patterning methods for semiconductor devices and structures resulting therefrom | Tai-Yen Peng, Wen-Yen Chen | 2024-06-04 |
| 11996345 | Package structure and manufacturing method thereof | Po-Yuan Cheng, Pu Wang, Li-Hui Cheng, Szu-Wei Lu | 2024-05-28 |
| 11990575 | Light-emitting device | Hsin-Ying Wang, Chien-Chih Liao, Chao-Hsing Chen, Wu-Tsung Lo, Tsun-Kai Ko +1 more | 2024-05-21 |
| 11894287 | Adhesive and thermal interface material on a plurality of dies covered by a lid | Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu, Chih-Chien Pan | 2024-02-06 |
| 11869822 | Semiconductor package and manufacturing method thereof | Po-Yuan Cheng, Pu Wang, Li-Hui Cheng | 2024-01-09 |