Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068173 | Package structure and manufacturing method thereof | Li-Hui Cheng, Szu-Wei Lu, Chih-Hao Chen | 2024-08-20 |
| 12033912 | Package structure and manufacturing method thereof | Li-Hui Cheng, Pu Wang, Szu-Wei Lu | 2024-07-09 |
| 11973005 | Coplanar control for film-type thermal interface | Yu-Hsun Wang, Pu Wang, Li-Hui Cheng, Szu-Wei Lu | 2024-04-30 |