Issued Patents 2024
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176261 | Method of fabricating package structure | Chih-Hao Chen, Chin-Fu Kao, Szu-Wei Lu | 2024-12-24 |
| 12170236 | Method for forming package structure | Chih-Hao Chen, Chih-Chien Pan, Chin-Fu Kao, Szu-Wei Lu | 2024-12-17 |
| 12132004 | Semiconductor devices and methods of manufacture | Chih-Hao Chen, Pu Wang, Szu-Wei Lu | 2024-10-29 |
| 12100640 | High efficiency heat dissipation using thermal interface material film | Chih-Hao Chen, Hung-Yu Chen, Pu Wang, Szu-Wei Lu | 2024-09-24 |
| 12068173 | Package structure and manufacturing method thereof | Szu-Wei Lu, Ping-Yin Hsieh, Chih-Hao Chen | 2024-08-20 |
| 12057432 | Integrated fan-out package structures with recesses in molding compound | Po-Hao Tsai, Jui-Pin Hung, Jing-Cheng Lin | 2024-08-06 |
| 12033912 | Package structure and manufacturing method thereof | Ping-Yin Hsieh, Pu Wang, Szu-Wei Lu | 2024-07-09 |
| 11996345 | Package structure and manufacturing method thereof | Chih-Hao Chen, Po-Yuan Cheng, Pu Wang, Szu-Wei Lu | 2024-05-28 |
| 11973005 | Coplanar control for film-type thermal interface | Yu-Hsun Wang, Ping-Yin Hsieh, Pu Wang, Szu-Wei Lu | 2024-04-30 |
| 11942403 | Integrated circuit package and method | Chih-Chien Pan, Chin-Fu Kao, Szu-Wei Lu | 2024-03-26 |
| 11923259 | Package structure and method of manufacturing the same | Pu Wang, Szu-Wei Lu, Tsung-Fu Tsai | 2024-03-05 |
| 11901255 | Semiconductor device and method of forming the same | Chih-Chien Pan, Chin-Fu Kao, Szu-Wei Lu | 2024-02-13 |
| 11894287 | Adhesive and thermal interface material on a plurality of dies covered by a lid | Chih-Hao Chen, Chin-Fu Kao, Szu-Wei Lu, Chih-Chien Pan | 2024-02-06 |
| 11869822 | Semiconductor package and manufacturing method thereof | Chih-Hao Chen, Po-Yuan Cheng, Pu Wang | 2024-01-09 |