JH

Jui-Pin Hung

TSMC: 1 patents #2,264 of 4,162Top 55%
Overall (2024): #398,537 of 561,600Top 75%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12057432 Integrated fan-out package structures with recesses in molding compound Po-Hao Tsai, Li-Hui Cheng, Jing-Cheng Lin 2024-08-06