Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142579 | Package structure and manufacturing method thereof | Shih-Ting Lin, Szu-Wei Lu, Chen-Hsuan Tsai, I-Ting Huang | 2024-11-12 |
| 12142499 | Pickup apparatus and method of using the same | Yi-Jung Chen, Szu-Wei Lu | 2024-11-12 |
| 12119324 | Package structure | Kung-Chen Yeh, Szu-Wei Lu, Ying-Ching Shih | 2024-10-15 |
| 12046561 | Package structure and method of fabricating the same | Szu-Wei Lu | 2024-07-23 |
| 12020952 | Method of fabricating semiconductor device having dummy micro bumps between stacking dies | Chen-Hsuan Tsai, Chung Chieh TING, Shih-Ting Lin, Szu-Wei Lu | 2024-06-25 |
| 11990351 | Semiconductor package and manufacturing method thereof | Jiun-Ting Chen, Chih-Wei Wu, Szu-Wei Lu, Ying-Ching Shih, Ting-Yu Yeh +1 more | 2024-05-21 |
| 11948896 | Package structure | Kung-Chen Yeh, I-Ting Huang, Shih-Ting Lin, Szu-Wei Lu | 2024-04-02 |
| 11923259 | Package structure and method of manufacturing the same | Pu Wang, Li-Hui Cheng, Szu-Wei Lu | 2024-03-05 |