Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142579 | Package structure and manufacturing method thereof | Tsung-Fu Tsai, Shih-Ting Lin, Szu-Wei Lu, I-Ting Huang | 2024-11-12 |
| 12020952 | Method of fabricating semiconductor device having dummy micro bumps between stacking dies | Tsung-Fu Tsai, Chung Chieh TING, Shih-Ting Lin, Szu-Wei Lu | 2024-06-25 |
| 11990351 | Semiconductor package and manufacturing method thereof | Jiun-Ting Chen, Chih-Wei Wu, Szu-Wei Lu, Tsung-Fu Tsai, Ying-Ching Shih +1 more | 2024-05-21 |