Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12074119 | Chip package structure | Ying-Ching Shih, Szu-Wei Lu, Chih-Wei Wu | 2024-08-27 |
| 11990351 | Semiconductor package and manufacturing method thereof | Chih-Wei Wu, Szu-Wei Lu, Tsung-Fu Tsai, Ying-Ching Shih, Ting-Yu Yeh +1 more | 2024-05-21 |