Issued Patents 2024
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183681 | Package structure having bridge structure for connection between semiconductor dies | Chih-Wei Wu | 2024-12-31 |
| 12148661 | Method of forming integrated fan-out packages with built-in heat sink | Chih-Wei Wu, Szu-Wei Lu, Jing-Cheng Lin, Long Hua Lee | 2024-11-19 |
| 12148733 | Shift control method in manufacture of semiconductor device | Chih-Wei Wu, Hsien-Ju Tsou | 2024-11-19 |
| 12119324 | Package structure | Kung-Chen Yeh, Szu-Wei Lu, Tsung-Fu Tsai | 2024-10-15 |
| 12087727 | Joint structure in semiconductor package and manufacturing method thereof | Kuan-Yu Huang, Chih-Wei Wu, Sung-Hui Huang, Shang-Yun Hou, Cheng-Chieh Li | 2024-09-10 |
| 12080617 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Li-Chung Kuo, Szu-Wei Lu, Jing-Cheng Lin, Long Hua Lee +1 more | 2024-09-03 |
| 12074119 | Chip package structure | Jiun-Ting Chen, Szu-Wei Lu, Chih-Wei Wu | 2024-08-27 |
| 12033978 | Semiconductor package and manufacturing method thereof | Chih-Wei Wu, Szu-Wei Lu | 2024-07-09 |
| 12033949 | Package structure with bridge die laterally wrapped by insulating encapsulant and surrounded by through vias and method of forming the package structure | Yu-Hung Lin, Chih-Wei Wu, Chia-Nan Yuan, An-Jhih Su, Szu-Wei Lu +2 more | 2024-07-09 |
| 12033968 | Package structure including stacked pillar portions | Jung-Hua Chang, Szu-Wei Lu | 2024-07-09 |
| 12021008 | Thermal interface materials, 3D semiconductor packages and methods of manufacture | Chen-Hua Yu, Li-Chung Kuo, Szu-Wei Lu | 2024-06-25 |
| 12015023 | Integrated circuit package and method of forming same | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more | 2024-06-18 |
| 11990429 | Dummy die placement without backside chipping | Chih-Wei Wu, Kung-Chen Yeh, Li-Chung Kuo, Pu Wang, Szu-Wei Lu | 2024-05-21 |
| 11990351 | Semiconductor package and manufacturing method thereof | Jiun-Ting Chen, Chih-Wei Wu, Szu-Wei Lu, Tsung-Fu Tsai, Ting-Yu Yeh +1 more | 2024-05-21 |
| 11967546 | Giga interposer integration through Chip-On-Wafer-On-Substrate | Shang-Yun Hou, Hsien-Pin Hu, Sao-Ling Chiu, Wen-Hsin Wei, Ping-Kang Huang +5 more | 2024-04-23 |
| 11955459 | Package structure | Shu-Hang Liao, Chih-Wei Wu, Jing-Cheng Lin, Szu-Wei Lu | 2024-04-09 |