Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033949 | Package structure with bridge die laterally wrapped by insulating encapsulant and surrounded by through vias and method of forming the package structure | Yu-Hung Lin, Chih-Wei Wu, Ying-Ching Shih, An-Jhih Su, Szu-Wei Lu +2 more | 2024-07-09 |
| 11935836 | Semiconductor devices | Yu-Hung Lin, An-Jhih Su, Der-Chyang Yeh, Shih-Guo Shen, Ming-Shih Yeh | 2024-03-19 |