Issued Patents 2024
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159853 | Package structure including IPD and method of forming the same | Hua-Wei Tseng, Yueh-Ting Lin, Shao-Yun Chen, Li-Hsien Huang, Ming-Shih Yeh +1 more | 2024-12-03 |
| 12142524 | Via for component electrode connection | Chen-Hua Yu, Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu, Der-Chyang Yeh +1 more | 2024-11-12 |
| 12119320 | Chip package structure with bump | Wei-Yu Chen, Li-Hsien Huang, Hsien-Wei Chen | 2024-10-15 |
| 12087745 | Package structure and manufacturing method thereof | Wei-Yu Chen, Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang, Po-Hao Tsai +2 more | 2024-09-10 |
| 12062602 | Semiconductor package and method of manufacturing the same | Li-Hsien Huang, Der-Chyang Yeh, Hua-Wei Tseng, Chiang-Hung Lin, Ming-Shih Yeh | 2024-08-13 |
| 12033949 | Package structure with bridge die laterally wrapped by insulating encapsulant and surrounded by through vias and method of forming the package structure | Yu-Hung Lin, Chih-Wei Wu, Chia-Nan Yuan, Ying-Ching Shih, Szu-Wei Lu +2 more | 2024-07-09 |
| 12021051 | Semiconductor package and method of forming the same | Hsien-Wei Chen | 2024-06-25 |
| 12020953 | Fan-out structure and method of fabricating the same | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, Wei-Yu Chen | 2024-06-25 |
| 12009335 | Structure and method of forming a joint assembly | Ying-Ju Chen, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu, Chen-Hua Yu | 2024-06-11 |
| 11961800 | Via for semiconductor device connection and methods of forming the same | Chen-Hua Yu, Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu, Der-Chyang Yeh +1 more | 2024-04-16 |
| 11935836 | Semiconductor devices | Yu-Hung Lin, Der-Chyang Yeh, Shih-Guo Shen, Chia-Nan Yuan, Ming-Shih Yeh | 2024-03-19 |
| 11929322 | Method of forming device and package structure | Hsien-Wei Chen, Li-Hsien Huang | 2024-03-12 |
| 11908795 | Package structures and method of forming the same | Chen-Hua Yu | 2024-02-20 |
| 11901196 | Method for forming photonic integrated package | Chen-Hua Yu, Wei-Yu Chen | 2024-02-13 |