Issued Patents 2024
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183681 | Package structure having bridge structure for connection between semiconductor dies | Ying-Ching Shih | 2024-12-31 |
| 12148733 | Shift control method in manufacture of semiconductor device | Ying-Ching Shih, Hsien-Ju Tsou | 2024-11-19 |
| 12148661 | Method of forming integrated fan-out packages with built-in heat sink | Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin, Long Hua Lee | 2024-11-19 |
| 12131488 | Electronic apparatus and method used for object tracking | Chien-Hao Chen, Chao-Hsun Yang, Shih-Tse Chen | 2024-10-29 |
| 12125306 | Method and apparatus for person re-identification | Chien-Hao Chen, Chao-Hsun Yang, Shih-Tse Chen | 2024-10-22 |
| 12087727 | Joint structure in semiconductor package and manufacturing method thereof | Kuan-Yu Huang, Sung-Hui Huang, Shang-Yun Hou, Ying-Ching Shih, Cheng-Chieh Li | 2024-09-10 |
| 12074119 | Chip package structure | Jiun-Ting Chen, Ying-Ching Shih, Szu-Wei Lu | 2024-08-27 |
| 12033978 | Semiconductor package and manufacturing method thereof | Ying-Ching Shih, Szu-Wei Lu | 2024-07-09 |
| 12033949 | Package structure with bridge die laterally wrapped by insulating encapsulant and surrounded by through vias and method of forming the package structure | Yu-Hung Lin, Chia-Nan Yuan, Ying-Ching Shih, An-Jhih Su, Szu-Wei Lu +2 more | 2024-07-09 |
| 11990429 | Dummy die placement without backside chipping | Ying-Ching Shih, Kung-Chen Yeh, Li-Chung Kuo, Pu Wang, Szu-Wei Lu | 2024-05-21 |
| 11990351 | Semiconductor package and manufacturing method thereof | Jiun-Ting Chen, Szu-Wei Lu, Tsung-Fu Tsai, Ying-Ching Shih, Ting-Yu Yeh +1 more | 2024-05-21 |
| 11955459 | Package structure | Shu-Hang Liao, Jing-Cheng Lin, Szu-Wei Lu, Ying-Ching Shih | 2024-04-09 |
| 11924481 | Automated workflows from media asset differentials | Yadong Wang, Kyle Tacke, Shilpa Jois Rao, Boney Sekh, Andrew Swan +1 more | 2024-03-05 |