CL

Cheng-Chieh Li

TSMC: 1 patents #2,264 of 4,162Top 55%
Overall (2024): #510,104 of 561,600Top 95%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12087727 Joint structure in semiconductor package and manufacturing method thereof Kuan-Yu Huang, Chih-Wei Wu, Sung-Hui Huang, Shang-Yun Hou, Ying-Ching Shih 2024-09-10