Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087733 | Packages with multiple types of underfill and method forming the same | Kuan-Yu Huang, Sung-Hui Huang, Shang-Yun Hou | 2024-09-10 |
| 12080617 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin, Long Hua Lee +1 more | 2024-09-03 |
| 12051668 | Semiconductor package and method of forming the same | Kuan-Yu Huang, Sung-Hui Huang, Shang-Yun Hou, Tsung-Yu Chen, Chien-Yuan Huang | 2024-07-30 |
| 12021008 | Thermal interface materials, 3D semiconductor packages and methods of manufacture | Chen-Hua Yu, Ying-Ching Shih, Szu-Wei Lu | 2024-06-25 |
| 12015023 | Integrated circuit package and method of forming same | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more | 2024-06-18 |
| 11990429 | Dummy die placement without backside chipping | Chih-Wei Wu, Ying-Ching Shih, Kung-Chen Yeh, Pu Wang, Szu-Wei Lu | 2024-05-21 |