Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119324 | Package structure | Szu-Wei Lu, Tsung-Fu Tsai, Ying-Ching Shih | 2024-10-15 |
| 11990429 | Dummy die placement without backside chipping | Chih-Wei Wu, Ying-Ching Shih, Li-Chung Kuo, Pu Wang, Szu-Wei Lu | 2024-05-21 |
| 11948896 | Package structure | Tsung-Fu Tsai, I-Ting Huang, Shih-Ting Lin, Szu-Wei Lu | 2024-04-02 |