Issued Patents 2024
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176874 | Signal receiving circuit and noise filtering method thereof | — | 2024-12-24 |
| 12165978 | Package structure and method of manufacturing the same | Szu-Wei Lu | 2024-12-10 |
| 12142579 | Package structure and manufacturing method thereof | Tsung-Fu Tsai, Szu-Wei Lu, Chen-Hsuan Tsai, I-Ting Huang | 2024-11-12 |
| 12051652 | Package structure and method of fabricating the same | Chi-Hsi Wu, Chen-Hua Yu, Szu-Wei Lu | 2024-07-30 |
| 12020952 | Method of fabricating semiconductor device having dummy micro bumps between stacking dies | Tsung-Fu Tsai, Chen-Hsuan Tsai, Chung Chieh TING, Szu-Wei Lu | 2024-06-25 |
| 12009022 | Semiconductor device for memory device | — | 2024-06-11 |
| 11959939 | Chip socket, testing fixture and chip testing method thereof | — | 2024-04-16 |
| 11948896 | Package structure | Tsung-Fu Tsai, Kung-Chen Yeh, I-Ting Huang, Szu-Wei Lu | 2024-04-02 |
| 11942750 | Laser inspection system | Yi-Chi Lee, Hsin-Chia Su, Yu-Cheng Song, Fu-Shun Ho, Chih-Chun Chen | 2024-03-26 |