Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12020952 | Method of fabricating semiconductor device having dummy micro bumps between stacking dies | Tsung-Fu Tsai, Chen-Hsuan Tsai, Shih-Ting Lin, Szu-Wei Lu | 2024-06-25 |
CT
Chung Chieh TING
Overall (2024): #505,742 of 561,600Top 95%
1
Patents 2024