Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142579 | Package structure and manufacturing method thereof | Tsung-Fu Tsai, Shih-Ting Lin, Szu-Wei Lu, Chen-Hsuan Tsai | 2024-11-12 |
| 11948896 | Package structure | Tsung-Fu Tsai, Kung-Chen Yeh, Shih-Ting Lin, Szu-Wei Lu | 2024-04-02 |