Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159853 | Package structure including IPD and method of forming the same | Yueh-Ting Lin, Shao-Yun Chen, Li-Hsien Huang, An-Jhih Su, Ming-Shih Yeh +1 more | 2024-12-03 |
| 12062602 | Semiconductor package and method of manufacturing the same | Li-Hsien Huang, An-Jhih Su, Der-Chyang Yeh, Chiang-Hung Lin, Ming-Shih Yeh | 2024-08-13 |
| 11984410 | Air channel formation in packaging process | Wan-Yu Lee, Chiang Lin, Yueh-Ting Lin, Li-Hsien Huang, Yu-Hsiang Hu | 2024-05-14 |
| 11961796 | Semiconductor package dielectric substrate including a trench | Yueh-Ting Lin, Ming-Shih Yeh, Der-Chyang Yeh | 2024-04-16 |