Issued Patents 2024
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170207 | Stacked semiconductor devices and methods of forming same | Hsien-Wei Chen, Li-Hsien Huang | 2024-12-17 |
| 12159853 | Package structure including IPD and method of forming the same | Hua-Wei Tseng, Yueh-Ting Lin, Shao-Yun Chen, Li-Hsien Huang, An-Jhih Su +1 more | 2024-12-03 |
| 12142524 | Via for component electrode connection | Chen-Hua Yu, Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu, Ming-Shih Yeh +1 more | 2024-11-12 |
| 12087745 | Package structure and manufacturing method thereof | Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Li-Hsien Huang, Po-Hao Tsai +2 more | 2024-09-10 |
| 12062602 | Semiconductor package and method of manufacturing the same | Li-Hsien Huang, An-Jhih Su, Hua-Wei Tseng, Chiang-Hung Lin, Ming-Shih Yeh | 2024-08-13 |
| 12051616 | Wafer level chip scale packaging intermediate structure apparatus and method | Chen-Hua Yu | 2024-07-30 |
| 12033949 | Package structure with bridge die laterally wrapped by insulating encapsulant and surrounded by through vias and method of forming the package structure | Yu-Hung Lin, Chih-Wei Wu, Chia-Nan Yuan, Ying-Ching Shih, An-Jhih Su +2 more | 2024-07-09 |
| 12020953 | Fan-out structure and method of fabricating the same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Hsien-Wei Chen, Wei-Yu Chen | 2024-06-25 |
| 12009335 | Structure and method of forming a joint assembly | Ying-Ju Chen, An-Jhih Su, Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu | 2024-06-11 |
| 11984405 | Pad structure design in fan-out package | Chen-Hua Yu, Shin-Puu Jeng, Hsien-Wei Chen | 2024-05-14 |
| 11961800 | Via for semiconductor device connection and methods of forming the same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu +1 more | 2024-04-16 |
| 11961796 | Semiconductor package dielectric substrate including a trench | Yueh-Ting Lin, Hua-Wei Tseng, Ming-Shih Yeh | 2024-04-16 |
| 11955401 | Package structure | Shih-Hui Wang, Shih-Peng Tai, Tsung-Shu Lin, Yi-Chung Huang | 2024-04-09 |
| 11935836 | Semiconductor devices | Yu-Hung Lin, An-Jhih Su, Shih-Guo Shen, Chia-Nan Yuan, Ming-Shih Yeh | 2024-03-19 |
| 11862606 | Packages with metal line crack prevention design | Chen-Hua Yu, Shin-Puu Jeng, Hsien-Wei Chen, Jie Chen | 2024-01-02 |