Issued Patents 2024
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176270 | Package structure with photonic die and method | Hsien-Wei Chen, Ming-Fa Chen | 2024-12-24 |
| 12176248 | Wafer level dicing method and semiconductor device | Hsien-Wei Chen | 2024-12-24 |
| 12119338 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Jie Chen, Hsien-Wei Chen | 2024-10-15 |
| 12068241 | Semiconductor structure | Hsien-Wei Chen | 2024-08-20 |
| 12050216 | Method of detecting antibodies against JEV or ZIKV using recombinant baculoviruses expressing prM/e | Tzong-Yuan Wu, Szu-Cheng KUO, Pei-Yun SHU, Chang-Chi LIN, Der-Jiang CHIAO +3 more | 2024-07-30 |
| 12009386 | Structure and method for forming integrated high density MIM capacitor | Hsien-Wei Chen, Jie Chen, Ming-Fa Chen | 2024-06-11 |
| 12009335 | Structure and method of forming a joint assembly | An-Jhih Su, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu, Chen-Hua Yu | 2024-06-11 |
| 11960675 | Display apparatus | Dongxin Qi, Aichen Xu, Caixia Zhao, Yuxin Zhang | 2024-04-16 |
| 11942436 | Passivation scheme design for wafer singulation | Hsien-Wei Chen, Ming-Fa Chen | 2024-03-26 |
| 11908692 | Method for fabricating a chip package | Jie Chen, Hsien-Wei Chen, Tzuan-Horng Liu | 2024-02-20 |
| 11862590 | Integrated circuit package and method of forming thereof | Hsien-Wei Chen, Ming-Fa Chen | 2024-01-02 |
| 11862599 | Bonding to alignment marks with dummy alignment marks | Hsien-Wei Chen, Ming-Fa Chen | 2024-01-02 |