Issued Patents 2024
Showing 1–25 of 61 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183728 | Process control for package formation | Hsien-Wei Chen | 2024-12-31 |
| 12176344 | Methods of forming semiconductor structure | Hsien-Wei Chen | 2024-12-24 |
| 12176257 | Semiconductor structure having an anti-arcing pattern disposed on a passivation layer | Sheng-An Kuo, Ching-Jung Yang, Hsien-Wei Chen, Jie Chen | 2024-12-24 |
| 12176270 | Package structure with photonic die and method | Hsien-Wei Chen, Ying-Ju Chen | 2024-12-24 |
| 12170264 | Integrated circuit packages and methods of forming the same | Chih-Chia Hu, Sung-Feng Yeh | 2024-12-17 |
| 12166014 | Manufacturing method of package | Sung-Feng Yeh, Jian-Wei Hong | 2024-12-10 |
| 12165971 | Package having different metal densities in different regions and manufacturing method thereof | Hsien-Wei Chen, Jie Chen, Sen-Bor Jan | 2024-12-10 |
| 12154897 | Package structures | Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2024-11-26 |
| 12154862 | System and method for aligned stitching | Chih-Chia Hu, Chang-Ching Yu | 2024-11-26 |
| 12154875 | Package and method of fabricating the same | Chao-Wen Shih, Tzuan-Horng Liu, Jen-Li Hu | 2024-11-26 |
| 12148664 | Semiconductor device and method having a through substrate via and an interconnect structure | Tzuan-Horng Liu, Chao-Wen Shih | 2024-11-19 |
| 12136619 | Methods of manufacturing three-dimensional integrated circuit structures | Hsien-Wei Chen, Sung-Feng Yeh | 2024-11-05 |
| 12132029 | Integrating passive devices in package structures | Chih-Chia Hu | 2024-10-29 |
| 12125821 | Package having multiple chips integrated therein and manufacturing method thereof | Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2024-10-22 |
| 12125819 | Die on die bonding structure | Chao-Wen Shih, Sung-Feng Yeh | 2024-10-22 |
| 12125820 | Through-dielectric vias for direct connection and method forming same | Chuan-An Cheng, Sung-Feng Yeh, Chih-Chia Hu | 2024-10-22 |
| 12125769 | Package structure and method of fabricating the same | Hsien-Wei Chen, Jie Chen, Sung-Feng Yeh | 2024-10-22 |
| 12119328 | Methods of fabricating the same die stack structure and semiconductor structure | Chao-Wen Shih, Min-Chien Hsiao, Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu | 2024-10-15 |
| 12119318 | Bonding structure and method of forming same | Hsien-Wei Chen, Jie Chen | 2024-10-15 |
| 12113005 | Packages with Si-substrate-free interposer and method forming same | Chen-Hua Yu | 2024-10-08 |
| 12113036 | Semiconductor package and manufacturing method thereof | Hsien-Wei Chen, Sen-Bor Jan, Chih-Chia Hu | 2024-10-08 |
| 12094852 | Package structure and method of manufacturing the same | Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2024-09-17 |
| 12087668 | Semiconductor package and method for manufacturing the same | Hsien-Wei Chen, Jie Chen | 2024-09-10 |
| 12087755 | Method of fabricating package structure | Hsien-Wei Chen, Jie Chen | 2024-09-10 |
| 12080702 | Method of fabricating package structure | Hsien-Wei Chen, Jie Chen | 2024-09-03 |