Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119328 | Methods of fabricating the same die stack structure and semiconductor structure | Ming-Fa Chen, Chao-Wen Shih, Min-Chien Hsiao, Sung-Feng Yeh, Tzuan-Horng Liu | 2024-10-15 |
| 12057439 | Integrated circuit packages | Ming-Fa Chen, Tzuan-Horng Liu, Chao-Wen Shih, Sung-Feng Yeh | 2024-08-06 |
| 12015013 | Die stack structure, semiconductor structure and method of fabricating the same | Ming-Fa Chen, Chao-Wen Shih, Min-Chien Hsiao, Sung-Feng Yeh, Tzuan-Horng Liu | 2024-06-18 |