MH

Min-Chien Hsiao

TSMC: 2 patents #1,566 of 4,162Top 40%
Overall (2024): #135,314 of 561,600Top 25%
2
Patents 2024

Issued Patents 2024

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
12119328 Methods of fabricating the same die stack structure and semiconductor structure Ming-Fa Chen, Chao-Wen Shih, Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu 2024-10-15
12015013 Die stack structure, semiconductor structure and method of fabricating the same Ming-Fa Chen, Chao-Wen Shih, Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu 2024-06-18