Issued Patents 2024
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170264 | Integrated circuit packages and methods of forming the same | Chih-Chia Hu, Ming-Fa Chen | 2024-12-17 |
| 12166014 | Manufacturing method of package | Ming-Fa Chen, Jian-Wei Hong | 2024-12-10 |
| 12154897 | Package structures | Ming-Fa Chen, Tzuan-Horng Liu, Chao-Wen Shih | 2024-11-26 |
| 12136619 | Methods of manufacturing three-dimensional integrated circuit structures | Hsien-Wei Chen, Ming-Fa Chen | 2024-11-05 |
| 12125769 | Package structure and method of fabricating the same | Hsien-Wei Chen, Jie Chen, Ming-Fa Chen | 2024-10-22 |
| 12125821 | Package having multiple chips integrated therein and manufacturing method thereof | Ming-Fa Chen, Tzuan-Horng Liu, Chao-Wen Shih | 2024-10-22 |
| 12125820 | Through-dielectric vias for direct connection and method forming same | Ming-Fa Chen, Chuan-An Cheng, Chih-Chia Hu | 2024-10-22 |
| 12125819 | Die on die bonding structure | Ming-Fa Chen, Chao-Wen Shih | 2024-10-22 |
| 12119328 | Methods of fabricating the same die stack structure and semiconductor structure | Ming-Fa Chen, Chao-Wen Shih, Min-Chien Hsiao, Nien-Fang Wu, Tzuan-Horng Liu | 2024-10-15 |
| 12094852 | Package structure and method of manufacturing the same | Ming-Fa Chen, Tzuan-Horng Liu, Chao-Wen Shih | 2024-09-17 |
| 12074140 | System formed through package-in-package formation | Chen-Hua Yu, Ming-Fa Chen | 2024-08-27 |
| 12074131 | Package structure and manufacturing method thereof | Ming-Fa Chen, Hsien-Wei Chen, Jie Chen, Sen-Bor Jan | 2024-08-27 |
| 12057439 | Integrated circuit packages | Ming-Fa Chen, Tzuan-Horng Liu, Chao-Wen Shih, Nien-Fang Wu | 2024-08-06 |
| 12057437 | Package structure, chip structure and method of fabricating the same | Ming-Fa Chen, Tzuan-Horng Liu, Chao-Wen Shih | 2024-08-06 |
| 12057438 | Die stack structure and manufacturing method thereof | Chen-Hua Yu, Hsien-Wei Chen, Ming-Fa Chen, Tzuan-Horng Liu | 2024-08-06 |
| 12051673 | Package having multiple chips integrated therein and manufacturing method thereof | Ming-Fa Chen, Tzuan-Horng Liu, Chao-Wen Shih | 2024-07-30 |
| 12046579 | Package having bonding layers | Ming-Fa Chen, Chao-Wen Shih, Hsien-Wei Chen, Tzuan-Horng Liu | 2024-07-23 |
| 12020997 | Methods of forming semiconductor device packages having alignment marks on a carrier substrate | Chen-Hua Yu, Ming-Fa Chen, Hsien-Wei Chen, Hui Liu, Ching-Pin Yuan | 2024-06-25 |
| 12015013 | Die stack structure, semiconductor structure and method of fabricating the same | Ming-Fa Chen, Chao-Wen Shih, Min-Chien Hsiao, Nien-Fang Wu, Tzuan-Horng Liu | 2024-06-18 |
| 12002778 | Semiconductor packages and methods of forming the same | Ming-Fa Chen, Hsien-Wei Chen, Jie Chen | 2024-06-04 |
| 11978716 | Package | Hsien-Wei Chen, Ming-Fa Chen | 2024-05-07 |
| 11967553 | Semiconductor package and manufacturing method of the same | Ming-Fa Chen, Chen-Hua Yu | 2024-04-23 |
| 11955433 | Package-on-package device | Ming-Fa Chen, Hsien-Wei Chen | 2024-04-09 |
| 11916012 | Manufacturing method of semiconductor structure | Ming-Fa Chen, Tzuan-Horng Liu, Chao-Wen Shih | 2024-02-27 |
| 11916031 | Semiconductor device and method of manufacturing | Chih-Chia Hu, Ching-Pin Yuan, Sen-Bor Jan, Ming-Fa Chen | 2024-02-27 |