Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165971 | Package having different metal densities in different regions and manufacturing method thereof | Hsien-Wei Chen, Jie Chen, Ming-Fa Chen | 2024-12-10 |
| 12124078 | Photonic silicon spatial beam transformer integrated on 3DIC package and methods for forming the same | Kuan-Yu Huang, Yu-Yun Huang, Tien-Yu Huang, Sung-Hui Huang, Shang-Yun Hou | 2024-10-22 |
| 12113036 | Semiconductor package and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen, Chih-Chia Hu | 2024-10-08 |
| 12080629 | Manufacturing method of semiconductor structure | Chih-Chia Hu, Hsien-Wei Chen, Ming-Fa Chen | 2024-09-03 |
| 12074131 | Package structure and manufacturing method thereof | Ming-Fa Chen, Hsien-Wei Chen, Jie Chen, Sung-Feng Yeh | 2024-08-27 |
| 11923302 | Semiconductor device and method of manufacture | Fong-Yuan Chang, Noor Mohamed Ettuveettil, Po-Hsiang Huang, Ming-Fa Chen, Chin-Chou Liu +1 more | 2024-03-05 |
| 11916031 | Semiconductor device and method of manufacturing | Chih-Chia Hu, Ching-Pin Yuan, Sung-Feng Yeh, Ming-Fa Chen | 2024-02-27 |