Issued Patents 2024
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170264 | Integrated circuit packages and methods of forming the same | Ming-Fa Chen, Sung-Feng Yeh | 2024-12-17 |
| 12154862 | System and method for aligned stitching | Chang-Ching Yu, Ming-Fa Chen | 2024-11-26 |
| 12132029 | Integrating passive devices in package structures | Ming-Fa Chen | 2024-10-29 |
| 12125820 | Through-dielectric vias for direct connection and method forming same | Ming-Fa Chen, Chuan-An Cheng, Sung-Feng Yeh | 2024-10-22 |
| 12113036 | Semiconductor package and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen, Sen-Bor Jan | 2024-10-08 |
| 12080629 | Manufacturing method of semiconductor structure | Hsien-Wei Chen, Ming-Fa Chen, Sen-Bor Jan | 2024-09-03 |
| 12044977 | Multiple-mask multiple-exposure lithography and masks | Peter Yu, Chih-Tung Hsu, Kevin Wang, Roger Chen | 2024-07-23 |
| 11916031 | Semiconductor device and method of manufacturing | Ching-Pin Yuan, Sung-Feng Yeh, Sen-Bor Jan, Ming-Fa Chen | 2024-02-27 |
| 11908817 | Bonding structure of dies with dangling bonds | Hsien-Wei Chen, Ming-Fa Chen | 2024-02-20 |