Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125820 | Through-dielectric vias for direct connection and method forming same | Ming-Fa Chen, Sung-Feng Yeh, Chih-Chia Hu | 2024-10-22 |
CC
Chuan-An Cheng
Overall (2024): #515,160 of 561,600Top 95%
1
Patents 2024