Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12020997 | Methods of forming semiconductor device packages having alignment marks on a carrier substrate | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Hui Liu | 2024-06-25 |
| 11993066 | Chuck, lamination process, and manufacturing method of semiconductor package using the same | Wei Huang, Yu-Ching Lo, Wen-Chih Lin, Cheng-Yu Kuo, Yi-Yang Lei +1 more | 2024-05-28 |
| 11916031 | Semiconductor device and method of manufacturing | Chih-Chia Hu, Sung-Feng Yeh, Sen-Bor Jan, Ming-Fa Chen | 2024-02-27 |