Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051666 | Package structure and manufacturing method of package structure thereof | Po-Yuan Teng, Hao-Yi Tsai, Kuo Lung Pan, Sen-Kuei Hsu, Tin-Hao Kuo +2 more | 2024-07-30 |
| 11993066 | Chuck, lamination process, and manufacturing method of semiconductor package using the same | Wei Huang, Yu-Ching Lo, Ching-Pin Yuan, Wen-Chih Lin, Cheng-Yu Kuo +1 more | 2024-05-28 |
| 11878388 | Polishing pad, polishing apparatus and method of manufacturing semiconductor package using the same | Kuan-Cheng Wang, Ching-Hua Hsieh | 2024-01-23 |