Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166015 | Semiconductor package and manufacturing method of semiconductor package | Wei-Kang Hsieh, Hung-Yi Kuo, Hao-Yi Tsai, Ting Hao Kuo, Yu-Chia Lai +3 more | 2024-12-10 |
| 12057405 | Packages with thick RDLs and thin RDLs stacked alternatingly | Po-Yuan Teng, Yu-Chia Lai, Tin-Hao Kuo, Hao-Yi Tsai, Chen-Hua Yu | 2024-08-06 |
| 12051666 | Package structure and manufacturing method of package structure thereof | Po-Yuan Teng, Hao-Yi Tsai, Sen-Kuei Hsu, Tin-Hao Kuo, Yi-Yang Lei +2 more | 2024-07-30 |
| 12014979 | Methods of forming semiconductor packages | Shu-Rong Chun, Teng-Yuan Lo, Hung-Yi Kuo, Chih-Horng Chang, Tin-Hao Kuo +1 more | 2024-06-18 |
| 12014976 | Chip package structure including a silicon substrate interposer and methods for forming the same | Yu-Chia Lai, Teng-Yuan Lo, Mao-Yen Chang, Po-Yuan Teng, Chen-Hua Yu +3 more | 2024-06-18 |
| 12009281 | Package structure and method of manufacturing the same | Shih-Wei Chen, Hao-Yi Tsai, Tin-Hao Kuo, Po-Yuan Teng, Chi-Hui Lai | 2024-06-11 |
| 11990381 | Integrated circuit packages having support rings | Shu-Rong Chun, Tin-Hao Kuo, Hao-Yi Tsai, Pei-Hsuan Lee, Chien Ling Hwang +3 more | 2024-05-21 |
| 11942451 | Semiconductor structure and method of forming the same | Mao-Yen Chang, Yu-Chia Lai, Cheng-Shiuan Wong, Ting Hao Kuo, Ching-Hua Hsieh +2 more | 2024-03-26 |