Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176279 | Package structure and manufacturing method thereof | Sung-Yueh Wu, Jen-Chun Liao, Ching-Hua Hsieh, Pei-Hsuan Lee, Chia-Hung Liu | 2024-12-24 |
| 12062832 | Electronic device and manufacturing method thereof | Pei-Hsuan Lee, Ching-Hua Hsieh, Yu-Ting Chiu, Jui-Chang Kuo | 2024-08-13 |
| 12040247 | Package system and manufacturing method thereof | Pei-Hsuan Lee, Ching-Hua Hsieh | 2024-07-16 |
| 12040255 | Semiconductor package and manufacturing method thereof | Jen-Chun Liao, Sung-Yueh Wu, Ching-Hua Hsieh | 2024-07-16 |
| 12027494 | Semiconductor device and manufacturing method thereof | Hao-Yi Tsai, Tzuan-Horng Liu | 2024-07-02 |
| 11990381 | Integrated circuit packages having support rings | Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Pei-Hsuan Lee +3 more | 2024-05-21 |
| 11955349 | Anisotropic carrier for high aspect ratio fanout | Chen-Hua Yu | 2024-04-09 |