Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176279 | Package structure and manufacturing method thereof | Sung-Yueh Wu, Chien Ling Hwang, Jen-Chun Liao, Ching-Hua Hsieh, Pei-Hsuan Lee | 2024-12-24 |
| 12113022 | Semiconductor package and manufacturing method of semiconductor package | Ying-Cheng Tseng, Hao-Yi Tsai, Yu-Chih Huang | 2024-10-08 |
| 12068212 | Package structure with through via extending through redistribution layer and method of manufacturing the same | Chih-Hsuan Tai, Chih-Hua Chen, Hao-Yi Tsai, Yu-Chih Huang, Ting-Ting Kuo | 2024-08-20 |
| 12020873 | Sensing keyboard and sensing keyswitches thereof | Yu-Chun Hsieh, Chen Yang, Shao-Lun Hsiao | 2024-06-25 |
| 12015017 | Package structure, package-on-package structure and method of fabricating the same | Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Ting-Ting Kuo, Ban-Li Wu +2 more | 2024-06-18 |
| 12002768 | Semiconductor package and manufacturing method thereof | Yu-Chih Huang, Chih-Hao Chang, Po-Chun Lin, Chun-Ti Lu, Zheng-Gang Tsai +3 more | 2024-06-04 |
| 11929318 | Package structure and method of forming the same | Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Ban-Li Wu +2 more | 2024-03-12 |
| 11916025 | Device die and method for fabricating the same | Shih-Wei Chen, Tzuan-Horng Liu, Hao-Yi Tsai | 2024-02-27 |