Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159839 | Semiconductor packages | Tzu-Sung Huang, Hsiu-Jen Lin, Hao-Yi Tsai, Ming Hung Tseng, Tin-Hao Kuo +1 more | 2024-12-03 |
| 12125797 | Package structure with fan-out feature | Shing-Chao Chen, Chih-Wei Lin, Ming-Da Cheng, Ching-Hua Hsieh | 2024-10-22 |
| 12080653 | Formation method of chip package with fan-out structure | Shing-Chao Chen, Chih-Wei Lin, Ming-Da Cheng, Ching-Hua Hsieh | 2024-09-03 |
| 11942433 | Integrated circuit package and method | Chen-Hua Yu, Jen-Fu Liu, Ming Hung Tseng, Yen-Liang Lin, Tzu-Sung Huang | 2024-03-26 |
| 11935871 | Semiconductor package and method of fabricating the same | Hao-Yi Tsai, Cheng-Chieh Hsieh, Hui-Chun Chiang, Tzu-Sung Huang, Ming Hung Tseng +4 more | 2024-03-19 |
| 11929318 | Package structure and method of forming the same | Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu +2 more | 2024-03-12 |
| 11923318 | Method of manufacturing semiconductor package | Hsien-Ming Tu, Hao-Yi Tsai, Tin-Hao Kuo | 2024-03-05 |