Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125797 | Package structure with fan-out feature | Chih-Wei Lin, Tsung-Hsien Chiang, Ming-Da Cheng, Ching-Hua Hsieh | 2024-10-22 |
| 12080653 | Formation method of chip package with fan-out structure | Chih-Wei Lin, Tsung-Hsien Chiang, Ming-Da Cheng, Ching-Hua Hsieh | 2024-09-03 |
| 12033992 | Package and manufacturing method thereof | Ching-Hua Hsieh, Chih-Wei Lin, Sheng-Chieh Yang | 2024-07-09 |