Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087597 | Semiconductor structure comprising various via structures | Ming Hung Tseng, Yen-Liang Lin, Li-Ko Yeh, Hui-Chun Chiang, Cheng-Chieh Wu | 2024-09-10 |
| 11942433 | Integrated circuit package and method | Chen-Hua Yu, Ming Hung Tseng, Tsung-Hsien Chiang, Yen-Liang Lin, Tzu-Sung Huang | 2024-03-26 |