Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087597 | Semiconductor structure comprising various via structures | Jen-Fu Liu, Ming Hung Tseng, Yen-Liang Lin, Li-Ko Yeh, Cheng-Chieh Wu | 2024-09-10 |
| 11935871 | Semiconductor package and method of fabricating the same | Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Tzu-Sung Huang, Ming Hung Tseng +4 more | 2024-03-19 |