Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087597 | Semiconductor structure comprising various via structures | Jen-Fu Liu, Ming Hung Tseng, Yen-Liang Lin, Hui-Chun Chiang, Cheng-Chieh Wu | 2024-09-10 |
LY
Li-Ko Yeh
Overall (2024): #369,519 of 561,600Top 70%
1
Patents 2024