Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159839 | Semiconductor packages | Tzu-Sung Huang, Hsiu-Jen Lin, Hao-Yi Tsai, Tsung-Hsien Chiang, Tin-Hao Kuo +1 more | 2024-12-03 |
| 12087597 | Semiconductor structure comprising various via structures | Jen-Fu Liu, Yen-Liang Lin, Li-Ko Yeh, Hui-Chun Chiang, Cheng-Chieh Wu | 2024-09-10 |
| 12040283 | Method of fabricating semiconductor structure | Tzu-Sung Huang, Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo +4 more | 2024-07-16 |
| 12002799 | Die stacking structure and method forming same | Chen-Hua Yu, Hung-Yi Kuo, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh +1 more | 2024-06-04 |
| 11996227 | Hexagonal semiconductor package structure | Tzu-Sung Huang, Chen-Hua Yu, Hao-Yi Tsai, Hung-Yi Kuo | 2024-05-28 |
| 11942433 | Integrated circuit package and method | Chen-Hua Yu, Jen-Fu Liu, Tsung-Hsien Chiang, Yen-Liang Lin, Tzu-Sung Huang | 2024-03-26 |
| 11935804 | Integrated circuit package and method | Tzu-Sung Huang, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai, Chung-Shi Liu +2 more | 2024-03-19 |
| 11935871 | Semiconductor package and method of fabricating the same | Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Hui-Chun Chiang, Tzu-Sung Huang +4 more | 2024-03-19 |