Issued Patents 2024
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176321 | Semiconductor packages and method of forming the same | Hung-Jui Kuo, Chia-Wei Wang, Yu-Tzu Chang | 2024-12-24 |
| 12165985 | Semiconductor device and method | Chen-Hua Yu, Hung-Jui Kuo, Chung-Shi Liu, Han-Ping Pu, Ting-Chu Ko | 2024-12-10 |
| 12164232 | Method for removing resistor layer, and method of manufacturing semiconductor | Hung-Jui Kuo, Tai-Min Chang | 2024-12-10 |
| 12148732 | Package structure and method of fabrcating the same | Hung-Jui Kuo, Chia-Wei Wang, Yu-Tzu Chang | 2024-11-19 |
| 12132023 | Integrated circuit, package structure, and manufacturing method of package structure | Hung-Jui Kuo, Tai-Min Chang, Chia-Wei Wang | 2024-10-29 |
| 12080609 | Method of detecting photoresist scum, method of forming semiconductor package and photoresist scum detection apparatus | Hung-Jui Kuo, Chih-Yu Wang | 2024-09-03 |
| 12062603 | Semiconductor device having via sidewall adhesion with encapsulant | Chen-Hua Yu, Yun Chen Hsieh, Hung-Jui Kuo | 2024-08-13 |
| 12040283 | Method of fabricating semiconductor structure | Tzu-Sung Huang, Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hung-Yi Kuo, Hao-Yi Tsai +4 more | 2024-07-16 |
| 12021026 | Package structure and method of fabricating the same | Hung-Jui Kuo, Jyun-Siang Peng | 2024-06-25 |
| 12020983 | Processes for reducing leakage and improving adhesion | Yun Chen Hsieh, Hung-Jui Kuo, Chen-Hua Yu | 2024-06-25 |
| 11996381 | Package structure and method of fabricating the same | Hung-Jui Kuo, Jyun-Siang Peng | 2024-05-28 |
| 11990383 | Package structure having at least one die with a plurality of taper-shaped die connectors | Hung-Jui Kuo, Tai-Min Chang, Chia-Wei Wang | 2024-05-21 |
| 11961811 | Semiconductor structures and method of manufacturing the same | Chen-Hua Yu, Hung-Jui Kuo, Tsao-Lun Chang | 2024-04-16 |